n Chipset: Marvel 88E6185 n Non-Blocking OSI Data Layer 2+, Low-Latency n Ten Fully Independent 802.3 Media Access Controllers (MACs) n High-Speed Four Traffic Class QoS Switch Fabric n 8K MAC Address Look-Up Engine w/Integrated 1MB Frame Buffer Memory n Back-Pressure and Pause Frame-Based Flow Control | n Form Factor: PC/104-Plus n Dimensions (L x W): 3.550" x 3.775" (90x96 mm); 3.91” x 4.14” (99.31x105.16mm) w/thermal plates, excluding interface connector extension n Passive Thermal Management: Integrated Clam-Shell Heatsink Thermal Plates for Conductive Cooling to Optimize/Ease Integration with System Thermal Interface n Connectors: Stack-through PC104 and PC/104+ Buses (Power only); 3M HSHM Series Connectors (10x Copper Ethernet, 2x Fiber, RS-232, Zeroize, Reset, LEDs); Molex 2-pin right angle (Power); 12-pin (2x Fiber); Molex 4-pin (Fast Ethernet Mgmt) |
n IEEE 802.3 10 Mbps 10BASE-T (Ethernet) n IEEE 802.3u 100BASE-TX 100 Mbps (Fast Ethernet) n IEEE 802.3ab 1000BASE-T 1000 Mbps (Gigabit Ethernet) n IEEE 802.1d Spanning Tree (Bridging) n IEEE 802.1w Rapid Spanning Tree Protocol (RSTP) n IEEE 802.1p LAN Layer 2 Quality of Service/Class of Service Traffic Prioritization n IEEE 802.1Q Tagged VLANs / VLAN Trunking n RFC 2460 IP Protocol Support for IPv4 and IPv6 addressing n Telnet Server (for remote CLI management over Ethernet) Note: Legacy COM-1268 models with firmware prior to version 5.X may not support RSTP, Telnet, Web Server functionality | Qualified to MIL-STD-810G: n Operating Temperature: 0 to + 60°C (standard); -40° to +85°C(extended) / -40° to +185°F (MIL-810G, Methods 501,502) with proper thermal management n Storage Temperature: -50° to +85°C / -58° to 185°F (MIL-810G, Methods 501,502) n Operating Shock: 40g, 11ms, 3 pos/neg per axis, 18 terminal peak sawtooth pulses (MIL-STD-810G, Method 516) n Random Vibration: 5Hz to 2000Hz, 7.98 GRMS Power Spectral Density (PSD) Integral, 3 Axes, 1 Hour/Axis (MIL-STD-810G, Method 514, per Hybrid Jet, Helo, Ground Mobile & Tracked Vehicle Profile) n Humidity: Up to 95% RH @ 40C, Non-Condensing (by analysis) |
n Expansion: Any port can serve as link port for cascading multiple switches; Onboard IrDA interface supports recognition and management of two stacked COM-1268 boards under same console interface. n Data Transfer: 10 Mbits/sec, 100 Mbits/sec, or 1000Mbps n Duplex: Each Port Works at 10 Mbps or 100 Mbps, full or half-duplex mode; or 1000Mbps full-duplex mode n Auto-MDI/MDIX, Auto-Negotiation, Auto-Detect; Speed Auto-Sensing, Auto-Crossover, Port Mirroring, Port Monitoring | n No Moving Parts n Assembled to IPC-A-610 Class III Workmanship n Industrial Temperature Grade Components n Mean Time Between Failure (MTBF) per MIL-HDBK-217F @ 25°C n 283,438 Hours (32.3 Years), Ground Benign, Controlled n 42,038 Hours (4.8 Years), Airborne Inhabit Cargo, Commercial n 26,501 Hours (3.0 Years), Ground Mobile |
n Copper and Fiber Optic Capable: Up to 10 Ports Copper, Up to 4 Ports Fiber (1.25-GHz high-speed differential) n Fiber Detect Signal Switches Off Associated Copper Channel as Fiber Ports are Utilized | n Data Zeorization Support for Secure Data (Initiated by Offboard Signal Trigger); Recoverable Declassification (Erase Function Returns Board to Basic Unmanaged State) |
n Power Input: +5V Only (via ISA bus / PCI bus / Molex 2-pin connector) n Power Consumption: ~18 Watts (max) |
| n PRV-1336-02: Stacking PC104 Breakout Board Set (Mates 3M HSHM Connectors to RJ-45 for Testing/Configuration of PC38001 in Lab Environments) n Custom Heatsink / Thermal Interface n Conformal Coating n 3.3V Power Input on PCI Bus; Removal of PCI / ISA Bus |
