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< Intel® Xeon® Processor D-1500 Family up to 16 cores
< DDR4 memory technology up to 32GB with ECC
< 4 x4 PCIe and 4 x4 SRIO for VPX Data Plane communication
< OpenVPX MOD6-PAY-4F1Q2U2T-12.2.1-11 profile compliant
< Fast Customization
< Air Cooling & Conduction Cooling Version
6U VPX computing payload based on Intel® Xeon-D Processor
VP62107 supports Intel® Xeon-D Processors up to D-1577(16x 1.3GHz). Based on Broadwell microarchitecture, Xeon® Processor D-1577 possessor has 16 computing cores sharing 24MB L3 Cache, and its base operating frequency is 1.3GHz. VP62107 also supports Intel Turbo (automatic overclocking) technology enabling CPU maximum operating frequency up to 2.7GHz. By using Turbo technology of VP62107, users do not have to increase the cost or complexity of the system configuration just to meet the demand of system peak computing performance.
VP62107 provides 4 RapidIO (SRIO) x4 links for VPX Data Plane communication, 2 PCIe x8 links for VPX Expansion Plane communication, and 4 Gigabit Ethernet for VPX Control Plane communication. The rich data exchange technologies enable potential customers a much flexible integration options for box level or system level solution designs.
With up to 32GB ECC memory and 64GB onboard SLC flash storage, and rugged conduction cooling design, VP62107 is able to work in extended temperature (-40°C to 70°C) environment, which makes users no need to worry about the operation stability in hush environments. All of this ensure the high reliability and high availability of VP62107 and make it best fit for mission critical applications.
To meet the requirements of certain high density data processing applications and some of high end embedded display applications, VP62107 can be used with LinkedHope® XMC GPU board XM61000 or XM61001 (both support GPGPU functions).
In addition, LinkedHope® provides VP62107 a wealth of software drivers (BSP), including VxWorks, Linux, Windows, etc., which reduce the workloads of system integrators and product developers, and greatly shorten the time-to-market.
Other interfaces of VP62107 include: 4-channel serial ports, 4-channel USB 3.0/2.0, 4-channel SATA III, etc.
Target applications:
Communication, Intelligence analysis, Radar/Sonar, Medical imaging, Audio-video monitoring and processing
Standard | Dimension | |
n VITA 46, VITA 65 n OpenVPX MOD6-PAY-4F1Q2U2T-12.2.1-11 profile compliant | n 6U, 5HP/8HP | |
Weight | MTBF | |
n ≤850g | n ≥200000h | |
CPU | Storage | |
n Intel® Xeon® Processor D-15XX n Up to 16 Cores/32 threads, 24MB L3 Cache | n Onboard SSD (Up to 64GB SLC) n 2.5” SATA Disk, overlapped with XMC | |
Serial Interface | PCIe | |
n COM1 ports to the front panel (RS232 on RJ45) n COM2 ports to P4 (RS232) n COM3 ports to P4 (RS232) n COM4 ports to P4 (RS485) | n 16 Lanes PCI Express 3.0 to XMC connector n 2 Port 8 Lanes PCI Express 3.0 to VPX P2 connector n 1 Lanes PCI Express 3.0 to Intel® I210IT n 4 Lanes PCI Express 2.0 to PCIe to SRIO Bridge n 2 Lanes PCI Express 2.0 to Intel® 82580 n 1 Lanes PCI Express 2.0 to Intel® 82574 | |
Memory | SRIO | |
n Up to 32GB DDR4 SODIMM n Dual channel with ECC or non ECC | n 4 Ports x4 Lanes SRIO Rev 2.1 to VPX P1 Connector n Up to 5Gbps | |
VPX Interface | Environment | |
n P1 4x SRIOx4 Rev2.1 n P2 2x PCIex8 GEN3 (2 Port NT Capable) n P3 GPIOs, 2x RS232+1x RS485, KB/MS n P4 4 GbE (2x 1000BASE-T+2x 1000BASE-BX) n P5 2x SATA III, 2x USB 3.0 n P6 XMC Rear I/O | n Operation Temperature: 0°C to +60°C & -40°C to +70°C n Storage Temperature: -40°C to +85°C (without battery) n Humidity: 95%RH at 40°C | |
XMC | Network Interface | |
n One onboard XMC port for x16 PCI Express device n LinkedHope® XM61000(XM61001) is recommended for displays | n One Intel® 82580EB Quad GbE Controller n One Intel® 82574LM GbE Controller n One Intel® I210IT GbE Controller | |
Front Panel Interface | OS & BSP | |
n 2x USB 3.0 n 2x GbE：RJ-45 connectors n RS232：RJ-45 connector n LEDs | n Windows 7 n Windows Server 2008 R2/2012 R2 n Linux n VxWorks | |
Power Consumption | ||
n 50 ~ 80W |
